LÊ THẠC, T.; TRẦN HỒNG QUÂN. A solution to improve heat dissipation for closed circuit board chassis. Journal of Military Science and Technology, [S. l.], n. 84, p. 159–162, 2022. DOI: 10.54939/1859-1043.j.mst.84.2022.159-162. Disponível em: https://en.jmst.info/index.php/jmst/article/view/603. Acesso em: 21 nov. 2024.